FLIP CHIP TODAY'S SPONSOR:
A semiconductor chip or package connection process where solder balls or bumps are deposited
to form connecting metals on chip's surface or bonding pads, then flipped over for soldering or bonding
to corresponding header terminals on PCB or other substrate. Also known as flip-chip joining or flip flop bonding.
The result is a lower profile with shorter electrical path and lower resistance.
1,500 Electronics Industry Sourcing Sites of the Technology Data Exchange - Publishers of OEM Technology News & Electronic Assembly News
Flip Chip - Linked to trusted TDE listed vendors
|Adapters-Plus, Inc. - The Socket & Adapter Specialists
Banner Ads - Available Categories |
Add Your Site to the TDE by Midnight! |
24-Hour Search Engine Optimization
ADAPTERS-PLUS, INC. - Tracy, CA - - designers and manufacturer of cutting edge interconnect solutions for SMT and thru-hole applications. IC SOCKETS & ADAPTERS for BGA, LGA, PGA, CSP, PLCC, DIP, TSOP, TSSOP, SSOP, packages. IC package conversion for programming and prototyping, emulation, and a wide variety of board to board connectors and terminals. OEM custom designs available.
VISIT ALSO: www.FabsAndFoundries.com
(209)839-0200, Fax: (209)839-0235, E-mail: Sales@Adapt-Plus.com Request a quote
PALOMAR TECHNOLOGIES - Vista, CA - - Wire bonders for singulated die or entire wafer and hybrid circuit interconnects. Laser diode optoelectronics wire bonders, automated systems for gold wire ball bumping and thermocompression bonding of flip chips. Palomar's gold connection process is a self-contained, lead-free process without additional off-line processing required to complete die connections to substrates.
(800)854-3467, (760)931-3440, Fax: (760)931-3444, E-mail: Sales@Bonders.com Request a quote
Click to read our latest news release Palomar Technologies Relocates to New Carsbad HQ ~ Adds Expanded R&D, Prototyping, Cleanroom and Production Facilities
VISIT ALSO: www.SemiconductorFabrication.com
MORE SOURCES: 1,500 Electronics Industry Sourcing Sites
Ads below presented by Google under Google/TDE Partner Publisher arrangement