BGA - BALL GRID ARRAY
A leadless square chip package having an array of solder bumps/balls covering its underside
as its I/O interconnects for PCB surface-mounting, using a mass reflow solder process.
BGAs allow for a reduction in die package size, greater module densities, and better heat dissipation.
450 Electronics Industry Sourcing Sites of the Technology Data Exchange - Directory from the publishers of OEM Technology News
BGA - Ball Grid Array directory, linked to TDE members' Websites, E-mail, and RFQ Page, with up to 50 words to describe their line of BGA products for Electronics OEMs and their Contract Manufacturers. Also, their latest News Release may be hosted on this server, to be accessed by your click. The same News Release is then published in print in OEM Technology News or in Electronic Assembly News, each with 35,000 Guaranteed mailed copies to Original Equipment Manufacturers of Electronics-based products and their Contract Manufacturers. Additional distribution at Electronics Industry trade shows & expositions nationwide.
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ADAPTERS-PLUS, INC. - Tracy, CA - - designers and manufacturer of cutting edge interconnect solutions for SMT and thru-hole applications. IC SOCKETS & ADAPTERS for BGA, LGA, PGA, CSP, PLCC, DIP, TSOP, TSSOP, SSOP, packages. IC package conversion for programming and prototyping, emulation, and a wide variety of board to board connectors and terminals. OEM custom designs available. (209)839-0200, Fax: (209)839-0235, E-mail: Sales@Adapt-Plus.com
BEST, INC. - Rolling Meadows, IL - - Expert BGA REWORK SERVICES, ECO modifications and PCB rework. State of the art equipment and IPC certified operators insure the BGA rework will be done correctly and reliably. Compare your fully burdened overhead rate of rework/repair to our per board price - Turns as quick as 24 hours on BGA rework and reballing. (847)797-9250, Fax: (847)797-9255, E-mail: bwet@solder.net
EMULATION TECHNOLOGY, INC. - Santa Clara, CA - - ET designs and delivers 4,000+ high performance stock and custom IC
interconnect solutions for design and development engineers & technicians.
Production and test & burn-in, sockets & adapters in every package style.
ASAP rush service for BGA SOCKETS. Test probes to 10 GHz, MICTOR adapters, pogo pins, wireless solutions & more. (800)232-7837, (408)982-0660, Fax: (408)982-0664, E-mail: Sales@Emulation.com
FocalSpot, Inc. - San Diego, CA - Designers & manufacturers of affordable X-Ray inspection systems. Offering advanced BGA / SMT INSPECTION and rework systems, repair solutions for lead-free and eutectic rework, X-Ray failure analysis and rework applications support, parts and service to manufacturers of electronics assemblies worldwide.
(858)536-5050, Fax: (858)536-5054, E-mail: Sales@FocalSpot.com ..... ....
HEPCO, INC. - Sunnyvale, CA - - Designers and manufacturers of component lead formers, PCB depanelers, BGA re-balling equipment, RoHS/WEEE compliance analyzers and more! Please visit our website now and return to this page later for a complete description of our products. (408)738-1880, Fax: (408)732-4456, E-mail: Info@HepcoBlue.com
IRONWOOD ELECTRONICS - Burnsville, MN - - SOCKETS & ADAPTERS designed to provide access to, or conversion of, IC device signals for prototyping, probing, or production applications of CSP, BGA, DIP, PGA, PLCC, PQFP, SDIP, SOIC, QFP, & ZIP packages. Quick-turn, custom OEM adapters. Ask for free catalog.. (800)404-0204, (952)229-8200, Fax: (952)229-8201, E-mail: Info@IronwoodElectronics.com
SEMIPACK SERVICES, INC. - Jacksonville, FL - - component preparation and packaging solutions. Tape & reel packaging - lead forming - lead straightening - component baking to remove moisture prior to assembly - BGA REWORK to reball defective BGA chips - device programming - More! Working for contract manufacturers, component distributors, and end-user OEMs. Our services are conducted in accordance with IS9001/QS9000 standards
. (888)876-PACK, (904)733-3755, Fax: (904)733-9664, E-mail: Bwattson@SemiPack.com
YESTech, INC. - San Clemente, CA - - YESTech’s dual technology inspection system offers SMT and semiconductor packagers a complete BGA DEFECT DETECTION, combining both X-Ray and AOI to inspect for both visible and hidden defects. No other single system provides such a complete, high-quality inspection solution, requiring less than 30 minutes to create a complete inspection program. (949)361-2714, Fax: (949)361-2724, E-mail: Sales@YESTechInc.com
VISIT ALSO: www.PrintedCircuitAssembly.com
VISIT ALSO: www.ReworkAndRepair.com
MORE SOURCES: 450 Electronics Industry Sourcing Sites
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