CHIP SCALE ELECTRONICS
 Directory from the publishers of OEM Technology News - 575 OEM Sourcing Sites of the Technology Data Exchange

CHIP SCALE ELECTRONICS directory, linked to TDE members' Websites, E-mail, and RFQ Page, and 50 words to describe their line of semiconductor die attatch / die bonders. Also, their latest News Release may be hosted on this server, to be accessed by your click. The same News Release is then published in print in OEM Technology News or in Electronic Assembly News, each with 35,000 Guaranteed mailed copies to Original Equipment Manufacturers of Electronics-based products and their Contract Manufacturers. Additional distribution at Electronics industry trade shows & expositions nationwide.

TODAY'S SPONSOR:
Palomar Technologies - Precision Wire & Die Bonders Die Bonders - Wire Bonders - Laser Diode Attach - High Speed, Thermosonic Ball & Stitch Bonders - Gold Wire Ball Bumping - Large Area Wedge Bonders - Solderless Bump Process - Isotropic Conductive Adhesives - Polymer Flip Chip - Click Here to Enter or Call (800)854-3467 . . .

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PALOMAR TECHNOLOGIES - Vista, CA - - Wire bonders for singulated die or entire wafer and hybrid circuit interconnects. Laser diode optoelectronics wire bonders, automated systems for gold wire ball bumping and thermocompression bonding of flip chips. Palomar's gold connection process is a self-contained, lead-free process without additional off-line processing required to complete die connections to substrates. (800)854-3467, (760)931-3440, Fax: (760)931-3444, E-mail: Sales@Bonders.com
Click to read our latest news release Palomar Technologies Relocates to New Carsbad HQ ~ Adds Expanded R&D, Prototyping, Cleanroom and Production Facilities

VISIT ALSO: www.FabsAndFoundries.com
VISIT ALSO: www.SemiconductorFabrication.com
VISIT ALSO: www.Wire-Bonders.com
MORE SOURCES: 575 Electronics Industry Sourcing Sites

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gold wire ball bumping - - - thermocompression bonding - - - laser diode attach - - - ASIC - - - hybrid circuits
hybrid die bonding - - - flip chip bonding - - - thermosonic gold ball bonding - - - semiconductors


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