| Palomar Technologies - Precision Wire & Die Bonders |
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DATACON NORTH AMERICA, INC. - Trevose, PA - - Flexible, small-footprint semiconductor assembly solution for a wide veriety of applications indluding single chip COB, MCM, hybrid, stacked die, PBGA, FCBGA, CSP, SIP, etc. The Datacon 2200 apm+ handles wafers up to 300 mm, support tape & reel feeders, and die up to 50 mm, placement accuracy of 7µm@3s. (215)791-7070, Fax: (215)791-7074, E-mail: info.dcna@datacon.at TDE membership candidate: 6/9/08.
PALOMAR TECHNOLOGIES - Vista, CA - - Wire bonders for singulated die or entire wafer and hybrid circuit interconnects. Laser diode optoelectronics wire bonders, automated systems for gold wire ball bumping and thermocompression bonding of flip chips. Palomar's gold connection process is a self-contained, lead-free process without additional off-line processing required to complete die connections to substrates. (800)854-3467, (760)931-3440, Fax: (760)931-3444, E-mail: Sales@Bonders.com
Click to read our latest news release Palomar Technologies Relocates to New Carsbad HQ ~ Adds Expanded R&D, Prototyping, Cleanroom and Production Facilities
WORLD EQUIPMENT SOURCE - San Diego, CA - - WES (owned by R-1 Source, Inc.), buys and sells all types of pre-owned and new electronic production equipment, die bonders, wire bonders, and test equipment. Your one-stop source for PCB production and test equipment. We also sell and install lead-free retrofit kits for wave solder machines. (858)693-1991, Fax: (858)693-8339, E-mail: Sales@WEsource.com
VISIT ALSO: www.ChipScaleElectronics.com
VISIT ALSO: www.DieAttachers.com - or - www.DieAttachSystems.com
VISIT ALSO: www.EpoxyDieBonders.com
VISIT ALSO: www.EutecticDieBonders.com
VISIT ALSO: www.Flip-Chip.com
VISIT ALSO: www.GoldBallBonders.com VISIT ALSO: www.PCBassemblyEquipment.com VISIT ALSO: www.PrecisionDispensers.com VISIT ALSO: www.SemiconductorFabrication.com VISIT ALSO: www.ThermosonicBonders.com VISIT ALSO: www.UltrasonicBonders.com VISIT ALSO:
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