DIE ATTACHERS / DIE ATTACH SYSTEMS
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Palomar Technologies - Precision Wire & Die Bonders Die Bonders - Wire Bonders - Laser Diode Attach - High Speed, Thermosonic Ball & Stitch Bonders - Gold Wire Ball Bumping - Large Area Wedge Bonders - Solderless Bump Process - Isotropic Conductive Adhesives - Polymer Flip Chip - Click Here to Enter or Call (800)854-3467 . . .


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PALOMAR TECHNOLOGIES - Vista, CA - - Wire bonders for singulated die or entire wafer and hybrid circuit interconnects. Laser diode optoelectronics wire bonders, automated systems for gold wire ball bumping and thermocompression bonding of flip chips. Palomar's gold connection process is a self-contained, lead-free process without additional off-line processing required to complete die connections to substrates.
(800)854-3467, (760)931-3440, Fax: (760)931-3444, E-mail: Sales@Bonders.com Request a quote
Click to read our latest news release Palomar Technologies Relocates to New Carsbad HQ ~ Adds Expanded R&D, Prototyping, Cleanroom and Production Facilities

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