FLIP CHIP
A semiconductor chip or package connection process where solder balls or bumps are deposited
to form connecting metals on chip's surface or bonding pads, then flipped over for soldering or bonding
to corresponding header terminals on PCB or other substrate. Also known as flip-chip joining or flip flop bonding.
The result is a lower profile with shorter electrical path and lower resistance.
George Pachter, editor/publisher, Electronic Assembly News & OEM Technology News
325 Electronics Industry Sourcing Sites of the Technology Data Exchange - Directory from the publishers of OEM Technology News
FLIP CHIP directory, linked to TDE members' Websites, E-mail, and RFQ Page, and 50 words to describe their line of flip chip process products and associated technology. Also, their latest News Release may be hosted on this server, to be accessed by your click. The same News Release is then published in print in OEM Technology News or in Electronic Assembly News, each with 35,000 Guaranteed mailed copies to Original Equipment Manufacturers of Electronics-based products and their Contract Manufacturers. Additional distribution at Electronics industry trade shows & expositions nationwide.
TODAY'S SPONSOR:
|
|
| Adapters-Plus, Inc. - The Socket & Adapter Specialists
|
Keyword Response |
Banner Ads - Available Categories |
Join the Technology Data Exchange
ADAPTERS-PLUS, INC. - Tracy, CA - - designers and manufacturer of cutting edge interconnect solutions for SMT and thru-hole applications. IC SOCKETS & ADAPTERS for BGA, LGA, PGA, CSP, PLCC, DIP, TSOP, TSSOP, SSOP, packages. IC package conversion for programming and prototyping, emulation, and a wide variety of board to board connectors and terminals. OEM custom designs available. (209)839-0200, Fax: (209)839-0235, E-mail: Sales@Adapt-Plus.com
PALOMAR TECHNOLOGIES - Vista, CA - - Wire bonders for singulated die or entire wafer and hybrid circuit interconnects. Laser diode optoelectronics wire bonders, automated systems for gold wire ball bumping and thermocompression bonding of flip chips. Palomar's gold connection process is a self-contained, lead-free process without additional off-line processing required to complete die connections to substrates. (800)854-3467, (760)931-3440, Fax: (760)931-3444, E-mail: Sales@Bonders.com
Click to read our latest news release Palomar Technologies Relocates to New Carsbad HQ ~ Adds Expanded R&D, Prototyping, Cleanroom and Production Facilities
